TERMINOLOGY

Components that have some flaws but are still functional.

AS6081 is an aerospace quality management system standard developed by SAE International. It defines a set of rigorous, systematic practices for preventing substandard and counterfeit materials from entering the global supply chain and outlines how to avoid, detect, mitigate, and dispose of such materials.

This standard provides uniform requirements, practices, and test methods for test facilities to follow and is more stringent than those previously released for resellers (AS6081).

Bulk packaging of components, without special protection.

Certificate of Conformity. This document confirms that the components meet the industry-required standards.

Carrier tape is the most common form of packaging, which has pockets to contain components, typically used with reels.

A substance that absorbs water, used to remove moisture and keep components dry.

Electrostatic Discharge. This occurs when a static charge transfers between objects with different electrical potentials, and this transfer process is called ESD.

Intentional alteration of words or images on a document to change its original meaning.

Counterfeit words or images created to fabricate a new set of information for the components.

Components whose actual conditions, types, or sizes are inconsistent with the seller's description.

Humidity Indicator Card. HICs can estimate the humidity value of a package and the effectiveness of a desiccant through the change in dot color on the card.

Moisture Barrier Bag, a packaging type that is moisture-resistant, often used with desiccant and humidity indicators (HIC) as supplementary tools.

Moisture Sensitivity Level. A higher level indicates that a device requires more stringent protection against moisture.

Original Component Manufacturer

Preconditioning, recommended within the standard for solderability testing, involves baking or steaming. It serves as an advanced aging simulation that accelerates terminal plating impurities or defects that may affect solderability, ensuring the components will function properly when mounted.

Instruments that carrier tapes wrap around. This packaging form makes automatic component assembly more efficient.

Carriers that protect ESD-sensitive devices from damage.

The protective layer that covers the carrier tape, safeguarding the components within.

The ability to trace a component's part number and manufacturer.

Containers for components, mainly used for larger-sized components or those with easily-damaged pins.

A type of packaging primarily used for rectangular, chip components, small surface-mount devices (SMDs), or uniquely-shaped components.

Components that have features or issues rendering them unusable.