Industry Glossary – White Horse Wikichips

Moisture Sensitivity Level (MSL) is a rating from 0 to 6, assigned by the manufacturer after thorough life-cycle testing on every component they manufacture. It is a rating of the components’ susceptibility to damage caused by moisture. Humidity in the air can be absorbed by the component insulation material, leading to internal corrosion, separation of layers within the device, hardware failure and a phenomenon called “popcorning”. The MSL standard is detailed about exactly how long components can be exposed (floor life depending on MSL level and ambient humidity and temperature) before requiring baking to remove the moisture.

Solderability is a failure of the solder to wet on the component leads and make a good electrical and mechanical connection. Oxidation and corrosion of the plated leads on the component can lead to poor solderability, as can any contamination on the terminals, including dust and oil. White Horse utilizes the JEDEC standards for testing a component’s solderability.

Re-taping of components packaged in reels is necessary when all of the components have been removed for inspection, testing, or baking. The temperatures required for proper baking would melt the carrier (pocket) tape, so the components must be removed from the tape prior to baking. When the components have been removed, it is not recommended to try and reseal the original cover and carrier (pocket) tapes. The sealing is usually a heat process, lightly fusing the two tapes together. This creates a small “rail” in the carrier tape which, when re-used can cause an imperfect seal resulting pares parts falling out of the pockets or tearing of the cover tape in the manufacturer pick-and-place equipment which jams the feeders (a frustrating and time consuming situation to fix, which also causes a line stoppage).

Drop-Shipment - If you are located in, for example, North America, your supplier is in China with your customer is in Europe, does it make sense to ship the parts from China to the USA to be received and reshipped to Europe? No? It doesn’t make sense to us, either. Through our facility in Hong Kong, we can ship directly to end-user location at cull Customs value with any documentation and labeling requirements you may have. It’s that easy. Stop wasting money on excessive shipping expenses.

Transshipment – We ship all products through our Hong Kong facility, from where they are shipped in full compliance with receiving country’s documentation requirements. If you are purchasing from multiple sources, make sure you receive them without hassle at receiving declaration.

Warehousing – We do maintain storage locations in both Hong Kong and China when you have product that does not need to ship immediately. Hold it for consolidation on a larger shipment or when you know the final destination to avoid unnecessary shipping expenses.

Electrostratic Discharge (ESD) – build-up of static electricity transfered through a spark that can damage and cripple sensitive electronic components and assemblies.

Popcorning – a phenomenon where trapped moisture within a device that, when superheated during the reflow process, vaporizes and the extreme pressure within the device caused by the expanding team causes the device to bulger or rupture from within.

Decapsulation - also referred to as decap, delidding, die verification, and internal visual inspection. Through a chemical etching process (generally hycrochloric acid and red fuming nitric acid) or a mechanical removal process, the protective insulative body of a device is removed to expose the die(s) for high magnification analysis.

IPC-610S: ESDS (electrostatic discharge sensitive) components can fail to operate or change in value as a result of improper handling or processing. These failures can be immediate or latent (walking wounded). The result of immediate failure can be additional testing and rework or scrap. However the consequences of latent failure are the most serious. So ESD control is very important!

Delamination

JEDEC

IPC

IDEA

Group A Testing

Humidity Indicator Card (HIC) -

Moisture Barrier Bag (MBB) -

Dessicant

AS5553

AS6081

AS6171

ISO 9001:2008

AS9100

AS9120

SAE

Blacktopping

New

Unused

Refurbished

Used

Remarked

Counterfeit

Package

Packaging

Die

Wafer

Dry-Pack

Baking

Golden Sample

Approved Quality Level (AQL)

RoHS

China RoHS

ISO 17025

GIDEP

AWB

HAWB

BOL

BOM

EMS

OEM

ODM

CEM

INCOTERMS

Packing List

Commercial Invoice

Curve Trace

VAT

Ingot

Silicon

XRF

HCT

Dynasolve

DC Test

TCU

ASL/AVL

ITAR

Plating

Passive Components – include capacitors, resistors, inductors, transformers, and other single function devices that do not contain a die. They are electrical in nature and not electronic.